Information and Communications Technology and Policy

Information and Communications Technology and Policy

Information and Communications Technology and Policy ›› 2024, Vol. 50 ›› Issue (2): 46-54.doi: 10.12267/j.issn.2096-5931.2024.02.008

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Analysis of thermal challenges in servers for diverse computing power

LI Jian1, RUAN Di2   

  1. 1. Beijing SAN KUAI YUN Technology Co., Ltd., Beijing 100102, China
    2. Cloud Computing & Big Data Research Institute, China Academy of Information and Communications Technology, Beijing 100191, China
  • Received:2023-12-27 Online:2024-02-25 Published:2024-03-12

Abstract:

The diverse computing power presents significant challenges in server thermal design. This paper analyzes the cooling issues related to servers and identifies the main reasons for the limitations of thermal design in both general-purpose computing and intelligence computing servers. It also reclassifies commonly used thermal technologies based on whether the working medium changes phase. Then, this paper analyzes and introduces the core limiting factors that restrict the commercial scalability of cold-plate and immersion liquid cooling technologies,and gives an overview of the issues and prospects of common passive two-phase technologies. Finally, it proposes that cross-layer collaboration and cooperation are key factors in addressing the thermal challenges in servers.

Key words: diverse computing power, server, thermal design, liquid cooling, passive two-phase heat dissipation, cross-layer collaboration

CLC Number: